SLA White Photosensitive Resin 3D Printing Material

Photosensitive resin material is special 3 d printing materials, SLA rapid prototyping SLA (stereoLithographyApparatus) print stereoscopic 3 d printing, also known as the selective liquid photosensitive resin curing, usually referred to as for light curing.SLA technology is based on the principle of light curing of liquid photosensitive resin, this resin material in a certain wavelength and intensity of ultraviolet light (laser wavelength in the ultraviolet band, into a 325nm) under the irradiation can quickly cross-linking reaction and form the cured material.

The materials used for photosensitive resins are generally liquid photosensitive resins, such as photosensitive epoxy resin, photosensitive vinyl ether, photosensitive epoxy acrylic resin, photosensitive propylene resin, etc.The photosensitive resin is composed of two major parts, namely, the photoinitiator and the resin (the resin consists of a prepolymer, a diluent and a small amount of additives).When the photoinitiator is irradiated by ultraviolet light of a certain wavelength (3OONM-4OONM), it absorbs the light energy, changes from the ground state to the excited state, and then regenerates the active free radical, which initiates the polymerization and curing reaction of the prepolymer and active monomer.Thinners are mainly dilute

The role of release, to ensure that the photosensitive resin at room temperature has enough mobility, in order to make the next layer before the flow evenly.

The amount of photoinitiator and diluent has an important effect on the curing speed and curing quality of photosensitive resin.In a certain range, increasing the amount of photoinitiator can properly accelerate the curing speed, but if beyond a certain range, continue to increase, curing speed is not accelerated, but is reduced;The amount of diluent has a great influence on the liquid level speed. The large amount of diluent reduces the liquid viscosity and the leveling property is good. But when the amount of diluent is too large, the linear molecular chain interval is too large, and the chance of cross-linking with each other decreases, which is bound to affect the curing speed and quality.When the proportion of photoinitiator and diluent is appropriate, not only the curing speed is fast, but also the curing quality is better.

The selection of photosensitive resin material requires the following performance characteristics: in a certain frequency of monochromatic light under the irradiation of rapid curing and has a small critical exposure and large curing penetration depth;Curing shrinkage, curing shrinkage leads to deformation, warping, cracking and so on, which affects the precision of the forming parts, low shrinkage resin is conducive to forming high precision parts;Low viscosity, forming medium and low viscosity is conducive to the resin in the cured layer above the leveling;Small swelling, swelling of wet forming parts in liquid resin resulting in larger part size;Rapid prototype parts should have sufficient strength and good surface finish, and forming less toxic, and so on.Of course, there is no poison and no pollution after molding and cleaning, so you don’t have to worry about the use.

Technical parameters of 3D printing

1, a molding printing size: usually 600x600x400mm;Max one molding 1600X800X600mm without splicing

2, printing layer thickness: 0.05mm~0.25mm;

3, the accuracy can be achieved: molding accuracy: ±0.1mm (L≤100mm) or ±0.1%×L (L > 100mm)

4, post-processing: easy polishing, spraying, electroplating, drilling, can join large size objects;

Characteristics of photosensitive resin materials

It is a light-sensitive resin material similar to ABS with an opaque white appearance and durability.These printed parts can be polished, painted, sprayed and electroplated, very similar to ABS engineering plastics.

The above photosensitive resin properties are commonly used physical property data, of course, there are high temperature resistance, high hardness, high flexibility model can be selected.

Mechanical properties of photosensitive resin

Thermal and electrical properties